slws056c ? february 1997 ? revised september 2000 1 post office box 655303 ? dallas, texas 75265 operates from 4.8-v power supply for 900-mhz applications unconditionally stable wide uhf frequency range: 800 mhz to 1000 mhz 24.5 dbm typical output power linear ramp control transmit enable/disable control advanced bicmos processing technology for low-power consumption, high efficiency, and highly linear operation minimum of external components required for operation thermally enhanced surface-mount package for extremely small circuit footprint description the trf8011 rf transmit driver amplifier is for use in 800 to 1000 mhz wireless communication systems. it consists of a two-stage amplifier and a linear ramp controller for burst control in tdma (time-division multiple access) applications. very few external components are required for operation. the input is dc-blocked and requires no external matching. the output requires external matching suitable for the application frequency. the device is enabled when the txen input is held high. a power control signal applied to the vpc input can ramp the rf output power up or down to meet ramp and spurious emission specifications in tdma systems. the power control signal causes a linear change in output power as the voltage applied to vpc varies between 0 v and 3 v. with the rf input power applied to rfin at 5 dbm and txen high, adjusting vpc from 0 v to 3 v increases the output power from a typical value of ?50 dbm to 24.5 dbm at 900 mhz. forward isolation with the input power applied to rfin at 5 dbm, vpc = 0 v, and txen high is typically greater than 50 db. the trf8011 is available in a thermally enhanced, surface-mount, 20-pin powerpad ? (pwp) thin-shrink small outline package (tssop) and is characterized for operation from ?40 c to 85 c. the pwp package has a solderable pad that can improve the package thermal performance by bonding the pad to an external thermal plane. the pad also acts as a low-inductance electrical path to ground and must be electrically connected to the pcb ground plane as a continuation of the regular package terminals that are designated gnd. these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foa m during storage or handling to prevent electrostatic damage to the mos gates. please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. copyright ? 2000, texas instruments incorporated 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 gnd gnd rfin gnd nc vpc gnd nc v bb gnd gnd gnd rfout gnd gnd txen gnd v cc v cc gnd pwp package (top view) nc ? no internal connection powerpad is a trademark of texas instruments.
slws056c ? february 1997 ? revised september 2000 2 post office box 655303 ? dallas, texas 75265 functional block diagram bias/band gap reference linear ramp control 6 15 3 18 9 12, 13 v bb v cc rfout rfin txen vpc terminal functions terminal i/o description name no. i/o description gnd 1,2,4,7,10,11,14, 16,17,19,20 analog ground for all internal circuits. all signals are referenced to the ground terminals. nc 5, 8 no connection. it is recommended that all nc terminals be connected to ground. rfin 3 i rf input. rfin accepts signals between 800 mhz and 1000 mhz. rfout 18 o rf output. rfout is an open-collector output and requires a decoupled connection to v cc for operation. txen 15 i transmit enable input (digital). when txen is high, the output device is enabled. v bb 9 control section supply voltage v cc 12, 13 first stage bias vpc 6 i voltage power control. vpc is a signal between 0 v and 3 v that adjusts the output power from a typical value of ?50 dbm to 25.5 dbm. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc (see note 1) ?0.6 v to 5.6 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range at txen, vpc ?0.6 v to 5.6 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input power at rfin 10 dbm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . thermal resistance, junction to case, r jc (see note 2) 3.5 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . thermal resistance, junction to ambient, r ja (see note 3) 32 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous total power dissipation at t a = 25 c 3.9 w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . operating junction temperature, t j 110 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . junction temperature t j max 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . operating free-air temperature range, t a ?40 c to 85 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. voltage values are with respect to gnd. 2. no air flow and with infinite heatsink 3. with the thermal pad of the device soldered to a 1-ounce copper (cu) ground plane of an fr4 board with no air flow
slws056c ? february 1997 ? revised september 2000 3 post office box 655303 ? dallas, texas 75265 recommended operating conditions min nom max unit supply voltage: v cc (see note 1) 3 5 v high-level input voltage at txen, v ih v cc ? 0.8 v low-level input voltage at txen, v il 0.8 v operating free-air temperature, t a ?40 85 c note: 1. voltage values are with respect to gnd. electrical characteristics over full range of operating conditions parameter test conditions min typ ? max unit operating at maximum power out txen high, vpc = 3 v 190 200 250 ma i cc supply current from v cc operating at minimum power out txen high, vpc = 0 v 10 ma i cc supply current from v cc power down txen low, vpc = 0 v 0.05 ma ? typical values are at t a = 25 c v cc = 4.8 v , txen high , vpc = 3 v, t a = 25 c (unless otherwise noted) parameter test conditions min typ max unit operating frequency range 870 925 mhz output power p i = 5 dbm 23.5 24.5 25.5 dbm output power p i = 5 dbm, vpc = 0 v ?50 dbm gain (small signal) p i = ?20 dbm 29 db power added efficiency (pae) p i = 5 dbm 31 % input return loss (internally matched) p i = ?20 dbm 12 db harmonics 2f 0 p i = 5 dbm ?20 dbc harmonics 3f 0 p i = 5 dbm ?35 dbc noise power in 30 khz bandwidth 10 mhz above f 0 p i = 5 dbm ?92 dbm noise power in 30 khz bandwidth 20 mhz above f 0 p i = 5 dbm ?93 dbm stability parameter test conditions min typ max unit output vswr ? < 6:1 all phases, stability v cc < 5.6 v, p i = 5 dbm, output power 25 dbm, stability output frequency band : 200 mhz ? 1200 mhz ? vswr = voltage standing wave ratio no parasitic oscillations (all spurious < ?70 dbc) switching characteristics v cc = 4.8 v, t a = 25 c parameter test conditions min typ max unit t on switching time, rf output off to on txen = high, vpc stepped from 0 v to 3 v 1 s t off switching time, rf output on to off txen = high, vpc stepped from 3 v to 0 v 2 s
slws056c ? february 1997 ? revised september 2000 4 post office box 655303 ? dallas, texas 75265 application information a typical application example for gsm cellular telephone systems is shown in figure 1. in all cases, a capacitor must be connected from the positive power supply to ground, as close as possible to the ic terminals for power supply bypassing. a dc-blocking capacitor is also required on the rf output. a list of components and their functions is given in table 1. gnd gnd rfin gnd nc vpc gnd nc v bb gnd gnd gnd rfout gnd gnd txen gnd v cc v cc gnd 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 50 ? line l1 50 ? line 50 ? line c2 l2 c1 50 ? line c3 r1 c4 rf input rf output v cc board material type fr4, e r = 4.3, h = 12 mils l = 200 mils figure 1. typical gsm cellular telephone application table 1. external component selection component designation typical value function c1 4 pf output impedance matching capacitor c2 100 pf dc-blocking capacitor for rf output c3 1000 pf matching capacitor c4 1 f power supply decoupling capacitor l1 3.3 nh output impedance matching inductor l2 100 nh dc bias/rf choke r1 80 ? bias supply resistor
slws056c ? february 1997 ? revised september 2000 5 post office box 655303 ? dallas, texas 75265 typical characteristics figure 2 p i ? input power ? dbm 15 10 5 0 ?20 ?15 ?10 ?5 ? output power ? dbm 20 output power vs input power 25 0510 p o 85 c ?40 c 25 c v cc = 4.8 v vpc = 3 v f = 900 mhz figure 3 p i ? input power ? dbm 20 15 5 0 ?20 ?15 ?10 ?5 pae ? power added efficiency ? % 25 30 power added efficiency vs input power 35 0510 10 25 c 85 c ?40 c v cc = 4.8 v vpc = 3 v f = 900 mhz figure 4 26 25 24 23.5 860 870 880 890 900 26.5 27 f ? frequency ? mhz output power and power added efficiency vs frequency 27.5 910 920 930 35 30 25 20 15 10 5 0 25.5 24.5 p o pae pae ? power added efficiency ? % ? output power ? dbm p o 85 c 25 c ?40 c 85 c 25 c ?40 c v cc = 4.8 v vpc = 3 v p i = 5 dbm figure 5 ?10 ?20 ?40 ?50 0 0.5 1 1.5 10 20 vpc ? power control input ? v output power vs vpc gain control range 30 2 2.5 3 0 ?30 ? output power ? dbm p o 85 c 25 c ?40 c p i = 5 dbm v cc = 4.8 v f = 900 mhz
slws056c ? february 1997 ? revised september 2000 6 post office box 655303 ? dallas, texas 75265 typical characteristics figure 6 v cc = 4.8 v vpc = 3 v p i = ?20 dbm ?12 ?12.5 ?13 860 870 880 890 900 input return loss ? db ?11.5 f ? frequency ? mhz input return loss vs frequency ?11 910 920 930 85 c 25 c ?40 c 940
slws056c ? february 1997 ? revised september 2000 7 post office box 655303 ? dallas, texas 75265 mechanical data pwp (r-pdso-g**) powerpad ? plastic small-outline package 0,25 0,50 0,75 0,15 nom gage plane 4073225/e 03/97 6,60 6,20 0,30 0,19 11 4,30 4,50 10 20 a 1 1,20 max seating plane 0 ? 8 thermal pad (3,18 2,41 nom) (see note c) 0,10 0,65 m 0,10 28 9,80 24 7,90 9,60 7,70 16 5,10 14 5,10 4,90 4,90 dim a max a min pins ** 6,40 6,60 20 0,15 0,05 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. the package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. this solderable pad is electrically and thermally connected to the backside of the die and leads 1, 10, 11, and 20. powerpad is a trademark of texas instruments.
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dlp? products www.dlp.com broadband www.ti.com/broadband dsp dsp.ti.com digital control www.ti.com/digitalcontrol clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com military www.ti.com/military logic logic.ti.com optical networking www.ti.com/opticalnetwork power mgmt power.ti.com security www.ti.com/security microcontrollers microcontroller.ti.com telephony www.ti.com/telephony rfid www.ti-rfid.com video & imaging www.ti.com/video rf/if and zigbee? solutions www.ti.com/lprf wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2009, texas instruments incorporated
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